8479.89.95/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Machine that lap-grinds semiconductor wafers to precise flatness and thickness tolerances before fabrication. Classified HTS 8479.89.95 under wafer preparation grinders, lappers, and polishers for semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide flatness specification data (e.g

• <1 micron); common error is ignoring embedded metrology tools

• Use HTS advisory opinions

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8479.89.95