Machines for preparing biological samples for the subsequent diagnosis, testing, or analysis, as described in statistical note 7 to this chapter
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Other machines and mechanical appliances: > Other: > Other > Machines for preparing biological samples for the subsequent diagnosis, testing, or analysis, as described in statistical note 7 to this chapter
Duty Rate (from China)
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Products classified under HTS 8479.89.95.10
Conductivity Flat Grinder
Machine grinding precise flats on semiconductor boules to encode conductivity type and resistivity data. Specific to HTS 8479.89.95 crystal grinding equipment.
8479.89.95Automated Wafer Edge Grinder
Robotic edge grinding machine preventing wafer chipping during handling in fabs. HTS 8479.89.95 wafer grinder category.
8479.89.95High-Flatness Wafer Lapper
Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.
8479.89.95CMP Wafer Polishing Station
Complete chemical mechanical polishing station for wafer planarization. Full HTS 8479.89.95 semiconductor polisher coverage.
8479.89.95Silicon Ingot Grinder
Grinding machine for semiconductor silicon ingots to precise diameters with orientation flats for wafer slicing. Falls in HTS 8479.89.95 as crystal grinders per statistical notes on wafer manufacturing equipment.
8479.89.95Gallium Arsenide Wafer Slicer
Specialized saw for slicing fragile GaAs wafers from compound semiconductor boules. HTS 8479.89.95 includes such wafer slicing equipment for materials like gallium arsenide per official notes.
8479.89.95Double-Sided Wafer Grinder
Simultaneous double-sided grinding machine achieving uniform wafer thickness for semiconductor processing. Classified under HTS 8479.89.95 wafer grinders per statistical definitions.
8479.89.95Crystal boule Diameter Grinder
Precision grinder maintaining semiconductor boule diameter uniformity for consistent wafer yield. HTS 8479.89.95 as crystal grinders in wafer prep equipment.
8479.89.95Wafer Lapping Machine
Machine that lap-grinds semiconductor wafers to precise flatness and thickness tolerances before fabrication. Classified HTS 8479.89.95 under wafer preparation grinders, lappers, and polishers for semiconductor processing.
8479.89.95Semiconductor Wafer Polisher
Chemical-mechanical polisher (CMP) preparing wafer surfaces to atomic flatness for device fabrication. HTS 8479.89.95 covers wafer polishers as essential semiconductor preparation equipment per statistical notes.
8479.89.95Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by the Czochralski method, pulling a seed crystal from molten silicon to grow semiconductor ingots. It falls under HTS 8479.89.95 as specialized semiconductor manufacturing equipment not classified elsewhere in Chapter 84. Crystal growers and pullers are explicitly noted for wafer production.
8479.89.95Float Zone Crystal Grower
Equipment employing the float zone method to produce high-purity monocrystalline semiconductor boules without a crucible, ideal for silicon and gallium arsenide. Classified in HTS 8479.89.95 as other semiconductor manufacturing machines per statistical notes on crystal growers.
8479.89.95Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. HTS 8479.89.95 applies as wafer preparation equipment in semiconductor manufacturing per official notes.
8479.89.95Semiconductor Wafer Slicing Saw
High-precision diamond saw for slicing thin wafers from monocrystalline semiconductor boules like silicon. Falls under HTS 8479.89.95 as explicit wafer preparation equipment in statistical notes for semiconductor manufacturing.