Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by the Czochralski method, pulling a seed crystal from molten silicon to grow semiconductor ingots. It falls under HTS 8479.89.95 as specialized semiconductor manufacturing equipment not classified elsewhere in Chapter 84. Crystal growers and pullers are explicitly noted for wafer production.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If used for general industrial crystal growth
Machines for forming or producing semiconductor boules are in 8486 if not specifically for semiconductor wafers per statistical notes.
If primarily for testing boule quality
Some testing apparatus for semiconductor materials shifts to Chapter 90.
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Import Tips & Compliance
• Verify equipment meets statistical note definitions for semiconductor processing to avoid reclassification; provide detailed technical specs and end-use statements
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Related Products under HTS 8479.89.95
Conductivity Flat Grinder
Machine grinding precise flats on semiconductor boules to encode conductivity type and resistivity data. Specific to HTS 8479.89.95 crystal grinding equipment.
Automated Wafer Edge Grinder
Robotic edge grinding machine preventing wafer chipping during handling in fabs. HTS 8479.89.95 wafer grinder category.
High-Flatness Wafer Lapper
Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.
CMP Wafer Polishing Station
Complete chemical mechanical polishing station for wafer planarization. Full HTS 8479.89.95 semiconductor polisher coverage.
Silicon Ingot Grinder
Grinding machine for semiconductor silicon ingots to precise diameters with orientation flats for wafer slicing. Falls in HTS 8479.89.95 as crystal grinders per statistical notes on wafer manufacturing equipment.
Gallium Arsenide Wafer Slicer
Specialized saw for slicing fragile GaAs wafers from compound semiconductor boules. HTS 8479.89.95 includes such wafer slicing equipment for materials like gallium arsenide per official notes.