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8479.89.95/Wafer Lapping Machine/Mexico

Wafer Lapping Machine from Mexico

Machine that lap-grinds semiconductor wafers to precise flatness and thickness tolerances before fabrication. Classified HTS 8479.89.95 under wafer preparation grinders, lappers, and polishers for semiconductor processing.

Duty Rate — Mexico → United States

12.5%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Provide flatness specification data (e.g

• <1 micron); common error is ignoring embedded metrology tools

• Use HTS advisory opinions

Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8479.89.95