Double-Side Wafer Grinder/Polisher
Simultaneous double-side grinding/polishing machine processing both wafer faces for parallelism and thickness control in semiconductor prep. Per statistical note (b)(ii)(C).
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | 2.4% | +17.5% | 19.9% |
| π²π½Mexico | 2.4% | +10.0% | 12.4% |
| π¨π¦Canada | 2.4% | +10.0% | 12.4% |
| π©πͺGermany | 2.4% | +10.0% | 12.4% |
| π―π΅Japan | 2.4% | +10.0% | 12.4% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for single-purpose polishers
Single-function polishers separate from combination grind/polish machines.
If laboratory-scale processing
Small-scale lab equipment may classify as scientific apparatus.
If with dominant measuring functionality
Primary measuring machines with processing capability go to 9031.
Not sure which classification is right?
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Import Tips & Compliance
β’ Specify carrier plate design and slurry flow rates for dual-side processing
β’ Include thickness variation specs (TTV <0.5ΞΌm) proving semiconductor grade
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