Single-Side Wafer Lapping Machine
Machine that lap semiconductor wafers to precise thickness and flatness tolerances using abrasive slurries, preparing front surface for fabrication. Part of wafer preparation per statistical note (b)(ii)(C). HTS 8465.96.0040 as paring machine for hard materials.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for grinding/polishing machines specifically
Dedicated grinders/lappers for hard materials have separate 8464 provisions.
If centrifugal apparatus for slurry distribution
If emphasizing liquid handling over mechanical lapping, shifts to filtering/separating machines.
If with integrated thickness measurement
Testing instruments combined with processing may classify under Chapter 90.
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Import Tips & Compliance
• Specify slurry compatibility and flatness specs (<0.1 micron) in technical docs
• Pair with double-side lappers in shipment declarations for process sequence clarity
Related Products under HTS 8465.96.00.40
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