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8465.96.00.40/Single-Side Wafer Lapping Machine/Germany

Single-Side Wafer Lapping Machine from Germany

Machine that lap semiconductor wafers to precise thickness and flatness tolerances using abrasive slurries, preparing front surface for fabrication. Part of wafer preparation per statistical note (b)(ii)(C). HTS 8465.96.0040 as paring machine for hard materials.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify slurry compatibility and flatness specs (<0.1 micron) in technical docs

• Pair with double-side lappers in shipment declarations for process sequence clarity

Single-Side Wafer Lapping Machine from Germany — Import Duty Rate | HTS 8465.96.00.40