8465.96.00.40/Single-Side Wafer Lapping Machine/Japan

Single-Side Wafer Lapping Machine from Japan

Machine that lap semiconductor wafers to precise thickness and flatness tolerances using abrasive slurries, preparing front surface for fabrication. Part of wafer preparation per statistical note (b)(ii)(C). HTS 8465.96.0040 as paring machine for hard materials.

Duty Rate — Japan → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Specify slurry compatibility and flatness specs (<0.1 micron) in technical docs

• Pair with double-side lappers in shipment declarations for process sequence clarity