Single-Side Wafer Lapping Machine from China
Machine that lap semiconductor wafers to precise thickness and flatness tolerances using abrasive slurries, preparing front surface for fabrication. Part of wafer preparation per statistical note (b)(ii)(C). HTS 8465.96.0040 as paring machine for hard materials.
Duty Rate — China → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Specify slurry compatibility and flatness specs (<0.1 micron) in technical docs
• Pair with double-side lappers in shipment declarations for process sequence clarity