Double-Side Wafer Grinder/Polisher from Canada
Simultaneous double-side grinding/polishing machine processing both wafer faces for parallelism and thickness control in semiconductor prep. Per statistical note (b)(ii)(C).
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify carrier plate design and slurry flow rates for dual-side processing
• Include thickness variation specs (TTV <0.5μm) proving semiconductor grade