Double-Side Wafer Grinder/Polisher from Japan
Simultaneous double-side grinding/polishing machine processing both wafer faces for parallelism and thickness control in semiconductor prep. Per statistical note (b)(ii)(C).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify carrier plate design and slurry flow rates for dual-side processing
• Include thickness variation specs (TTV <0.5μm) proving semiconductor grade