8465.96.00.40/Double-Side Wafer Grinder/Polisher/Japan

Double-Side Wafer Grinder/Polisher from Japan

Simultaneous double-side grinding/polishing machine processing both wafer faces for parallelism and thickness control in semiconductor prep. Per statistical note (b)(ii)(C).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify carrier plate design and slurry flow rates for dual-side processing

• Include thickness variation specs (TTV <0.5μm) proving semiconductor grade