8465.96.00.40/Double-Side Wafer Grinder/Polisher/Germany

Double-Side Wafer Grinder/Polisher from Germany

Simultaneous double-side grinding/polishing machine processing both wafer faces for parallelism and thickness control in semiconductor prep. Per statistical note (b)(ii)(C).

Duty Rate — Germany → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify carrier plate design and slurry flow rates for dual-side processing

• Include thickness variation specs (TTV <0.5μm) proving semiconductor grade

Double-Side Wafer Grinder/Polisher from Germany — Import Duty Rate | HTS 8465.96.00.40