Okuma Multiple Spindle Precision Bore Drilling Machine
High-precision boring and drilling machine with multiple spindles optimized for creating accurate diameters on semiconductor crystal boules before wafer slicing. It matches HTS 8459.29.00.40 as an other multiple spindle drilling machine for metal removal in semiconductor processing equipment.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If numerically controlled (CNC) with unit construction
Unit head or way-type multi-spindle machines under 8459.21 if they feature modular unit heads differing from standard fixed multi-spindle setups.
If classified as semiconductor processing equipment broadly
Certain crystal processing machines may qualify under 8479.50 if primarily for semiconductor boule growth/preparation rather than general metalworking.
If equipped mainly for metrology rather than fabrication
Precision measuring machines for profile projection in semiconductor inspection fall under Chapter 90, not production drilling tools.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Document bore tolerances and spindle count meticulously for customs valuation and classification audits
• Use ISPM-15 compliant wooden crating for overseas shipping to prevent quarantine delays
• Avoid misclassification by specifying non-lathe operations; lathe-like turning shifts to HTS 8458
Related Products under HTS 8459.29.00.40
Haas Multi-Spindle CNC Drilling Machine
A computer numerical control (CNC) machine equipped with multiple spindles designed for high-volume precision drilling operations on metal parts in semiconductor wafer preparation. It falls under HTS 8459.29.00.40 as a multiple spindle drilling machine for removing metal, specifically suited for processing semiconductor crystal boules prior to wafer slicing. This classification aligns with equipment used in the grinding and preparation stages of wafer manufacturing.
DMG Mori Multi-Spindle Vertical Drilling Center
Vertical machining center featuring multiple synchronized spindles for simultaneous hole drilling in large semiconductor crystal ingots during boule preparation. Classified under HTS 8459.29.00.40 for its multiple spindle configuration in metal removal drilling, essential for creating precise flats indicating crystal properties as per statistical notes.
Mazak Versatech Multi-Spindle Gang Drill
Gang-style drilling machine with multiple independent spindles for efficient flat grinding preparation on semiconductor crystal ingots. Falls under HTS 8459.29.00.40 as other multiple spindle drilling machines used in the wafer preparation sequence outlined in statistical notes.
Brother Industries TC-40A Multi-Spindle Drill Head Machine
Compact multi-spindle drilling system tailored for high-throughput hole patterns in metal semiconductor material processing stages. Classified in HTS 8459.29.00.40 for its multiple spindle metal removal drilling function in wafer fabrication preparation.