DMG Mori Multi-Spindle Vertical Drilling Center
Vertical machining center featuring multiple synchronized spindles for simultaneous hole drilling in large semiconductor crystal ingots during boule preparation. Classified under HTS 8459.29.00.40 for its multiple spindle configuration in metal removal drilling, essential for creating precise flats indicating crystal properties as per statistical notes.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If single spindle configuration for lower volume production
Single-spindle drilling machines are classified separately under 8459.10, changing based on spindle count as per subheading structure.
If sold as a complete semiconductor wafer processing line component
Machines for semiconductor manufacturing not elsewhere specified may fall under 8479, especially if integrated into automated wafer prep systems.
If imported as modular tool station for assembly into larger systems
Parts and accessories for metalworking machine tools are under 8466 if not imported as complete functioning machines.
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Import Tips & Compliance
• Include CAD drawings and operational manuals demonstrating multi-spindle metal removal to comply with HTS specificity
• Ensure labeling distinguishes from lathe-type machines (HTS 8458) by highlighting drilling-only functionality
Related Products under HTS 8459.29.00.40
Okuma Multiple Spindle Precision Bore Drilling Machine
High-precision boring and drilling machine with multiple spindles optimized for creating accurate diameters on semiconductor crystal boules before wafer slicing. It matches HTS 8459.29.00.40 as an other multiple spindle drilling machine for metal removal in semiconductor processing equipment.
Haas Multi-Spindle CNC Drilling Machine
A computer numerical control (CNC) machine equipped with multiple spindles designed for high-volume precision drilling operations on metal parts in semiconductor wafer preparation. It falls under HTS 8459.29.00.40 as a multiple spindle drilling machine for removing metal, specifically suited for processing semiconductor crystal boules prior to wafer slicing. This classification aligns with equipment used in the grinding and preparation stages of wafer manufacturing.
Mazak Versatech Multi-Spindle Gang Drill
Gang-style drilling machine with multiple independent spindles for efficient flat grinding preparation on semiconductor crystal ingots. Falls under HTS 8459.29.00.40 as other multiple spindle drilling machines used in the wafer preparation sequence outlined in statistical notes.
Brother Industries TC-40A Multi-Spindle Drill Head Machine
Compact multi-spindle drilling system tailored for high-throughput hole patterns in metal semiconductor material processing stages. Classified in HTS 8459.29.00.40 for its multiple spindle metal removal drilling function in wafer fabrication preparation.