Mazak Versatech Multi-Spindle Gang Drill
Gang-style drilling machine with multiple independent spindles for efficient flat grinding preparation on semiconductor crystal ingots. Falls under HTS 8459.29.00.40 as other multiple spindle drilling machines used in the wafer preparation sequence outlined in statistical notes.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If includes honing capabilities beyond basic drilling
Honing or lapping machines for metal removal are under heading 8460, shifting classification when secondary finishing functions dominate.
If imported for semiconductor-specific mold or die preparation
Molds for semiconductor wafer processing fall under 8480 if designed exclusively for that end-use rather than general drilling.
Not sure which classification is right?
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Import Tips & Compliance
• Obtain manufacturer's declaration of conformity for CE marking if applicable to support safety compliance
• Break down shipments if exceeding de minimis for partial duty relief on accessories
Related Products under HTS 8459.29.00.40
Okuma Multiple Spindle Precision Bore Drilling Machine
High-precision boring and drilling machine with multiple spindles optimized for creating accurate diameters on semiconductor crystal boules before wafer slicing. It matches HTS 8459.29.00.40 as an other multiple spindle drilling machine for metal removal in semiconductor processing equipment.
Haas Multi-Spindle CNC Drilling Machine
A computer numerical control (CNC) machine equipped with multiple spindles designed for high-volume precision drilling operations on metal parts in semiconductor wafer preparation. It falls under HTS 8459.29.00.40 as a multiple spindle drilling machine for removing metal, specifically suited for processing semiconductor crystal boules prior to wafer slicing. This classification aligns with equipment used in the grinding and preparation stages of wafer manufacturing.
DMG Mori Multi-Spindle Vertical Drilling Center
Vertical machining center featuring multiple synchronized spindles for simultaneous hole drilling in large semiconductor crystal ingots during boule preparation. Classified under HTS 8459.29.00.40 for its multiple spindle configuration in metal removal drilling, essential for creating precise flats indicating crystal properties as per statistical notes.
Brother Industries TC-40A Multi-Spindle Drill Head Machine
Compact multi-spindle drilling system tailored for high-throughput hole patterns in metal semiconductor material processing stages. Classified in HTS 8459.29.00.40 for its multiple spindle metal removal drilling function in wafer fabrication preparation.