Haas Multi-Spindle CNC Drilling Machine
A computer numerical control (CNC) machine equipped with multiple spindles designed for high-volume precision drilling operations on metal parts in semiconductor wafer preparation. It falls under HTS 8459.29.00.40 as a multiple spindle drilling machine for removing metal, specifically suited for processing semiconductor crystal boules prior to wafer slicing. This classification aligns with equipment used in the grinding and preparation stages of wafer manufacturing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 4.2% | +35.0% | 39.2% |
| 🇲🇽Mexico | 4.2% | +10.0% | 14.2% |
| 🇨🇦Canada | 4.2% | +10.0% | 14.2% |
| 🇩🇪Germany | 4.2% | +10.0% | 14.2% |
| 🇯🇵Japan | 4.2% | +10.0% | 14.2% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If configured with integral machining centers for milling alongside drilling
Machines combining drilling with milling functions are classified under heading 8465 for multi-function machine tools rather than dedicated drilling machines.
If imported as standalone multiple spindle units without full machine tool base
Isolated spindles or heads for metalworking machines are covered under heading 8486 as parts, not complete machines of heading 8459.
If primarily for precision testing/inspection rather than material removal
Testing machines and apparatus for semiconductor devices fall under Chapter 90, distinguishing from production drilling equipment in Chapter 84.
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Import Tips & Compliance
• Verify machine specifications confirm multiple spindles and metal removal capability to avoid reclassification under single-spindle HTS codes
• Provide detailed technical documentation on CNC controls and semiconductor application to support duty rate claims during customs review
Related Products under HTS 8459.29.00.40
Okuma Multiple Spindle Precision Bore Drilling Machine
High-precision boring and drilling machine with multiple spindles optimized for creating accurate diameters on semiconductor crystal boules before wafer slicing. It matches HTS 8459.29.00.40 as an other multiple spindle drilling machine for metal removal in semiconductor processing equipment.
DMG Mori Multi-Spindle Vertical Drilling Center
Vertical machining center featuring multiple synchronized spindles for simultaneous hole drilling in large semiconductor crystal ingots during boule preparation. Classified under HTS 8459.29.00.40 for its multiple spindle configuration in metal removal drilling, essential for creating precise flats indicating crystal properties as per statistical notes.
Mazak Versatech Multi-Spindle Gang Drill
Gang-style drilling machine with multiple independent spindles for efficient flat grinding preparation on semiconductor crystal ingots. Falls under HTS 8459.29.00.40 as other multiple spindle drilling machines used in the wafer preparation sequence outlined in statistical notes.
Brother Industries TC-40A Multi-Spindle Drill Head Machine
Compact multi-spindle drilling system tailored for high-throughput hole patterns in metal semiconductor material processing stages. Classified in HTS 8459.29.00.40 for its multiple spindle metal removal drilling function in wafer fabrication preparation.