Haas Multi-Spindle CNC Drilling Machine from Mexico
A computer numerical control (CNC) machine equipped with multiple spindles designed for high-volume precision drilling operations on metal parts in semiconductor wafer preparation. It falls under HTS 8459.29.00.40 as a multiple spindle drilling machine for removing metal, specifically suited for processing semiconductor crystal boules prior to wafer slicing. This classification aligns with equipment used in the grinding and preparation stages of wafer manufacturing.
Duty Rate — Mexico → United States
Rate breakdown
Import Tips
• Verify machine specifications confirm multiple spindles and metal removal capability to avoid reclassification under single-spindle HTS codes
• Provide detailed technical documentation on CNC controls and semiconductor application to support duty rate claims during customs review