Haas Multi-Spindle CNC Drilling Machine from Japan

A computer numerical control (CNC) machine equipped with multiple spindles designed for high-volume precision drilling operations on metal parts in semiconductor wafer preparation. It falls under HTS 8459.29.00.40 as a multiple spindle drilling machine for removing metal, specifically suited for processing semiconductor crystal boules prior to wafer slicing. This classification aligns with equipment used in the grinding and preparation stages of wafer manufacturing.

Duty Rate — Japan → United States

14.2%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Verify machine specifications confirm multiple spindles and metal removal capability to avoid reclassification under single-spindle HTS codes

Provide detailed technical documentation on CNC controls and semiconductor application to support duty rate claims during customs review