Okuma Multiple Spindle Precision Bore Drilling Machine from Japan
High-precision boring and drilling machine with multiple spindles optimized for creating accurate diameters on semiconductor crystal boules before wafer slicing. It matches HTS 8459.29.00.40 as an other multiple spindle drilling machine for metal removal in semiconductor processing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document bore tolerances and spindle count meticulously for customs valuation and classification audits
• Use ISPM-15 compliant wooden crating for overseas shipping to prevent quarantine delays
• Avoid misclassification by specifying non-lathe operations; lathe-like turning shifts to HTS 8458