Wafer Slicing Saw Blade Assembly
Diamond-impregnated blade assembly for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8422.90.91.95 as parts of semiconductor wafer preparation equipment within the packing machinery chapter per statistical notes. Ensures precise, damage-free wafer production.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If generic circular saw blades
Non-specialized metalworking saw blades classify under tools of base metals, not machinery parts.
If parts for semiconductor fab tools
Some wafer prep parts may fall under Chapter 84 tool parts if not packing-specific.
If for microtom slicing in labs
Laboratory microscopes or precision slicers shift to optical/lab apparatus.
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Import Tips & Compliance
• Provide boule material compatibility certificates; ensure cleanroom packaging to avoid contamination claims; confirm saw model matches statistical note definitions
Related Products under HTS 8422.90.91.95
Czochralski Crystal Puller Spare Motor
Replacement electric motor for Czochralski crystal pullers used in semiconductor wafer manufacturing to produce monocrystalline silicon boules. This part falls under HTS 8422.90.91.95 as a component of specialized semiconductor processing machinery classified within packing or wrapping machinery parts per statistical notes. It enables precise control during crystal growth processes.
Crystal Grinder Spindle Kit
Precision spindle replacement kit for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. HTS 8422.90.91.95 covers this as parts of wafer preparation equipment in semiconductor statistical provisions. Critical for maintaining boule precision before slicing.
Wafer Lapping Machine Polishing Pad
Abrasive polishing pads for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. Falls under HTS 8422.90.91.95 per statistical notes for wafer preparation machinery parts. Ensures mirror-finish wafer surfaces critical for device processing.
Float Zone Crystal Grower Heating Element
High-frequency induction heating coil for float zone crystal growers producing ultra-pure semiconductor boules without crucibles. HTS 8422.90.91.95 includes parts for crystal growers per semiconductor statistical notes. Enables zone melting for defect-free silicon.
Semiconductor Wafer Edge Grinder Collet
Precision collet chuck for holding wafers during edge grinding to remove damage layers post-slicing. Part of wafer grinder equipment under HTS 8422.90.91.95 statistical provisions for semiconductor processing. Maintains wafer roundness and edge quality.
Wafer Polisher Slurry Distribution Ring
Ceramic ring distributing polishing slurry evenly across wafer surface in chemical mechanical polishers. HTS 8422.90.91.95 part for wafer polishing equipment in semiconductor notes. Achieves global planarization for device fabrication.