Wafer Slicing Saw Blade Assembly from Canada
Diamond-impregnated blade assembly for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8422.90.91.95 as parts of semiconductor wafer preparation equipment within the packing machinery chapter per statistical notes. Ensures precise, damage-free wafer production.
Duty Rate — Canada → United States
60%
Rate breakdown
9903.03.1450%Articles the product of Canada as provided in subdivision (b)(3) of U.S. note 51 to this subchapter
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide boule material compatibility certificates; ensure cleanroom packaging to avoid contamination claims; confirm saw model matches statistical note definitions