Other
Dishwashing machines; machinery for cleaning or drying bottles or other containers; machinery for filling, closing, sealing or labeling bottles, cans, boxes, bags or other containers; machinery for capsuling bottles, jars, tubes and similar containers; other packing or wrapping machinery (including heat-shrink wrapping machinery); machinery for aerating beverages; parts thereof: > Parts: > Other > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8422.90.91.95
Czochralski Crystal Puller Spare Motor
Replacement electric motor for Czochralski crystal pullers used in semiconductor wafer manufacturing to produce monocrystalline silicon boules. This part falls under HTS 8422.90.91.95 as a component of specialized semiconductor processing machinery classified within packing or wrapping machinery parts per statistical notes. It enables precise control during crystal growth processes.
Wafer Slicing Saw Blade Assembly
Diamond-impregnated blade assembly for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8422.90.91.95 as parts of semiconductor wafer preparation equipment within the packing machinery chapter per statistical notes. Ensures precise, damage-free wafer production.
Crystal Grinder Spindle Kit
Precision spindle replacement kit for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. HTS 8422.90.91.95 covers this as parts of wafer preparation equipment in semiconductor statistical provisions. Critical for maintaining boule precision before slicing.
Wafer Lapping Machine Polishing Pad
Abrasive polishing pads for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. Falls under HTS 8422.90.91.95 per statistical notes for wafer preparation machinery parts. Ensures mirror-finish wafer surfaces critical for device processing.
Float Zone Crystal Grower Heating Element
High-frequency induction heating coil for float zone crystal growers producing ultra-pure semiconductor boules without crucibles. HTS 8422.90.91.95 includes parts for crystal growers per semiconductor statistical notes. Enables zone melting for defect-free silicon.
Semiconductor Wafer Edge Grinder Collet
Precision collet chuck for holding wafers during edge grinding to remove damage layers post-slicing. Part of wafer grinder equipment under HTS 8422.90.91.95 statistical provisions for semiconductor processing. Maintains wafer roundness and edge quality.
Wafer Polisher Slurry Distribution Ring
Ceramic ring distributing polishing slurry evenly across wafer surface in chemical mechanical polishers. HTS 8422.90.91.95 part for wafer polishing equipment in semiconductor notes. Achieves global planarization for device fabrication.
Crystal Boule Flattener Tool Head
Diamond tool head for grinding orientation flats on semiconductor crystal boules to indicate resistivity type. Part of crystal grinder systems under HTS 8422.90.91.95 statistical notes. Ensures proper wafer alignment in later processing.
Wafer Sorter Conveyor Belt Module
Vacuum-assisted conveyor belt module for transferring prepared semiconductor wafers between processing stations. While primarily handling, classified as part of wafer prep machinery under HTS 8422.90.91.95 per broader statistical scope. Prevents wafer contamination and damage.
Monocrystalline Silicon Ingot Saw Guide
Precision guide rails for wire saws slicing silicon ingots into wafers, maintaining parallel cuts. HTS 8422.90.91.95 part for wafer slicing saws in semiconductor statistical notes. Critical for uniform wafer thickness control.