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8422.90.91.95/Wafer Slicing Saw Blade Assembly/Mexico

Wafer Slicing Saw Blade Assembly from Mexico

Diamond-impregnated blade assembly for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8422.90.91.95 as parts of semiconductor wafer preparation equipment within the packing machinery chapter per statistical notes. Ensures precise, damage-free wafer production.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Provide boule material compatibility certificates; ensure cleanroom packaging to avoid contamination claims; confirm saw model matches statistical note definitions

Wafer Slicing Saw Blade Assembly from Mexico — Import Duty Rate | HTS 8422.90.91.95