Wafer Slicing Saw Blade Assembly from Japan
Diamond-impregnated blade assembly for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8422.90.91.95 as parts of semiconductor wafer preparation equipment within the packing machinery chapter per statistical notes. Ensures precise, damage-free wafer production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide boule material compatibility certificates; ensure cleanroom packaging to avoid contamination claims; confirm saw model matches statistical note definitions