Clad High-Purity Aluminum Semiconductor Wafer Base Plate

Ultra-pure non-alloyed aluminum plate >6.3 mm thick, clad for semiconductor processing equipment bases. Purity prevents contamination. Fits 7606.91.60.55: thick clad non-alloyed plate.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.7%+35.0%37.7%
🇲🇽Mexico2.7%+10.0%12.7%
🇨🇦Canada2.7%+10.0%12.7%
🇩🇪Germany2.7%+10.0%12.7%
🇯🇵Japan2.7%+10.0%12.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7604.10.30Lower: 37.6% vs 37.7%

If high purity in unwrought forms

Unwrought 99.95%+ pure aluminum uses 7604 before plate rolling.

8486.90.00.00Lower: 25% vs 37.7%

If machined into vacuum chamber parts

Precision machined semiconductor equipment shifts to Chapter 84.

7606.12Lower: 16.5% vs 37.7%

If doped alloy semiconductor versions

Intentional trace elements make it alloyed aluminum plate.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide 99.99% purity spectrometry reports meeting chapter note (a)

Cleanroom packaging protocols mandatory for contamination-free entry

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