Clad High-Purity Aluminum Semiconductor Wafer Base Plate from China
Ultra-pure non-alloyed aluminum plate >6.3 mm thick, clad for semiconductor processing equipment bases. Purity prevents contamination. Fits 7606.91.60.55: thick clad non-alloyed plate.
Duty Rate — China → United States
37.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.91.0125%Effective with respect to entries on or after September 27, 2024, articles the product of China, as provided for in subdivision (b) of U.S. note 31 to this subchapter
Import Tips
• Provide 99.99% purity spectrometry reports meeting chapter note (a)
• Cleanroom packaging protocols mandatory for contamination-free entry