Clad High-Purity Aluminum Semiconductor Wafer Base Plate from Japan
Ultra-pure non-alloyed aluminum plate >6.3 mm thick, clad for semiconductor processing equipment bases. Purity prevents contamination. Fits 7606.91.60.55: thick clad non-alloyed plate.
Duty Rate — Japan → United States
12.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide 99.99% purity spectrometry reports meeting chapter note (a)
• Cleanroom packaging protocols mandatory for contamination-free entry