Clad High-Purity Aluminum Semiconductor Wafer Base Plate from Germany
Ultra-pure non-alloyed aluminum plate >6.3 mm thick, clad for semiconductor processing equipment bases. Purity prevents contamination. Fits 7606.91.60.55: thick clad non-alloyed plate.
Duty Rate — Germany → United States
52.7%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide 99.99% purity spectrometry reports meeting chapter note (a)
• Cleanroom packaging protocols mandatory for contamination-free entry