Boron-Doped Silicon Wafers

Silicon wafers doped with boron to create p-type semiconductors, typically 300mm in diameter for semiconductor fabrication. These are chemical elements (silicon) intentionally doped for electronic applications in integrated circuit production. Classified under HTS 3818.00.00 due to their disc/wafer form and doping for electronics.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+50.0%50%
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡¨πŸ‡¦CanadaFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8541Lower: 10% vs 50%

If fully fabricated into photosensitive semiconductor devices

Finished semiconductor devices like diodes fall under Chapter 85, not raw doped materials.

3824.99Lower: 15% vs 50%

If considered prepared chemical binders for electronics molds

Non-doped chemical compounds for molding may classify under chemical preparations.

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Import Tips & Compliance

β€’ Verify doping concentration and wafer specifications match import declaration to avoid reclassification

β€’ Obtain Material Safety Data Sheets (MSDS) and ensure compliance with semiconductor import regulations

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