Wafer Edge Profilometer

Specialized profilometer measuring edge geometry, chipping, and micro-cracks on semiconductor wafers that affect handling and yield. Critical for 300mm wafer processing. Classified HTS 9030.82.00.00 for wafer checking instruments.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

9031.49.90.00Same rate: 35%

If for general surface profilometers

Profilometers not specific to semiconductor wafer edges classified under other measuring instruments.

9013.80Lower: 14.5% vs 35%

If optical microscope with profilometry

Optical microscopes with secondary measuring functions go to 9013.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

• Document edge profiling resolution and bevel angle measurement capabilities

• Include SEMI standard compliance (M1, M78) references

• Specify exclusion of general surface roughness testers

Related Products under HTS 9030.82.00.00

Wafer Defect Inspection System

An optical and laser-based system designed to detect defects on silicon wafers during semiconductor manufacturing. It measures surface irregularities, particles, and pattern errors on wafers up to 300mm in diameter. Classified under HTS 9030.82.00.00 as it specifically checks semiconductor wafers for quality control.

Semiconductor Wafer Thickness Profiler

Non-contact laser profiler measuring wafer thickness variation across the entire surface to ensure uniformity for IC production. Detects thickness deviations down to nanometers. Falls under HTS 9030.82.00.00 for instruments checking semiconductor wafers.

Integrated Circuit Tester Prober Station

Automated prober station that electrically tests individual ICs and devices on wafers for functionality before dicing. Includes probe cards and test head interfaces. Classified in HTS 9030.82.00.00 for checking semiconductor devices including integrated circuits.

Wafer Particle Counter Scanner

Laser scattering system that scans wafers to count and size contamination particles that could cause IC defects. Meets strict cleanroom standards for semiconductor production. Under HTS 9030.82.00.00 for semiconductor wafer checking instruments.

Silicon Wafer Bow and Warp Metrology Tool

Capacitive and optical instrument measuring wafer bow, warp, and flatness critical for lithography alignment in IC fabrication. Supports 300mm wafers. HTS 9030.82.00.00 classification for semiconductor wafer checking.

IC Parametric Electrical Analyzer

Precision instrument testing electrical parameters of individual transistors and ICs on wafer for process control monitoring. Measures leakage current, threshold voltage, etc. Classified under HTS 9030.82.00.00 for semiconductor device checking.