Wafer Edge Profilometer from China
Specialized profilometer measuring edge geometry, chipping, and micro-cracks on semiconductor wafers that affect handling and yield. Critical for 300mm wafer processing. Classified HTS 9030.82.00.00 for wafer checking instruments.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Document edge profiling resolution and bevel angle measurement capabilities
• Include SEMI standard compliance (M1, M78) references
• Specify exclusion of general surface roughness testers