For measuring or checking semiconductor wafers or devices (including integrated circuits)
Oscilloscopes, spectrum analyzers and other instruments and apparatus for measuring or checking electrical quantities, excluding meters of heading 9028; instruments and apparatus for measuring or detecting alpha, beta, gamma, X-ray, cosmic or other ionizing radiations; parts and accessories thereof: > Other instruments and apparatus: > For measuring or checking semiconductor wafers or devices (including integrated circuits)
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 9030.82.00.00
Wafer Defect Inspection System
An optical and laser-based system designed to detect defects on silicon wafers during semiconductor manufacturing. It measures surface irregularities, particles, and pattern errors on wafers up to 300mm in diameter. Classified under HTS 9030.82.00.00 as it specifically checks semiconductor wafers for quality control.
Semiconductor Wafer Thickness Profiler
Non-contact laser profiler measuring wafer thickness variation across the entire surface to ensure uniformity for IC production. Detects thickness deviations down to nanometers. Falls under HTS 9030.82.00.00 for instruments checking semiconductor wafers.
Integrated Circuit Tester Prober Station
Automated prober station that electrically tests individual ICs and devices on wafers for functionality before dicing. Includes probe cards and test head interfaces. Classified in HTS 9030.82.00.00 for checking semiconductor devices including integrated circuits.
Wafer Particle Counter Scanner
Laser scattering system that scans wafers to count and size contamination particles that could cause IC defects. Meets strict cleanroom standards for semiconductor production. Under HTS 9030.82.00.00 for semiconductor wafer checking instruments.
Silicon Wafer Bow and Warp Metrology Tool
Capacitive and optical instrument measuring wafer bow, warp, and flatness critical for lithography alignment in IC fabrication. Supports 300mm wafers. HTS 9030.82.00.00 classification for semiconductor wafer checking.
IC Parametric Electrical Analyzer
Precision instrument testing electrical parameters of individual transistors and ICs on wafer for process control monitoring. Measures leakage current, threshold voltage, etc. Classified under HTS 9030.82.00.00 for semiconductor device checking.
Automated Wafer Alignment Verification System
Machine vision system verifying fiducial marks and alignment features on wafers for photolithography stepper accuracy. Essential for multi-layer IC patterning. HTS 9030.82.00.00 for semiconductor wafer checking instruments.
Semiconductor Wafer Resistivity Mapping System
Four-point probe system mapping resistivity variation across silicon wafers to monitor doping uniformity in IC fabrication. Generates 2D/3D resistivity maps. Under HTS 9030.82.00.00 for semiconductor wafer checking.
Wafer Edge Profilometer
Specialized profilometer measuring edge geometry, chipping, and micro-cracks on semiconductor wafers that affect handling and yield. Critical for 300mm wafer processing. Classified HTS 9030.82.00.00 for wafer checking instruments.
LED Wafer Testing Microprobe Station
Microprobe station electrically characterizing LED chips and microLED arrays on wafer before singulation. Tests luminous efficacy, forward voltage, etc. HTS 9030.82.00.00 for semiconductor device checking including optoelectronic ICs.
Power Semiconductor Wafer Mapper
High-voltage probe system mapping electrical characteristics of power device wafers (MOSFET, IGBT) for automotive and energy applications. Tests breakdown voltage distribution. Under HTS 9030.82.00.00 for semiconductor wafers/devices.
Compound Semiconductor Wafer Analyzer
Multi-technique analyzer for GaAs, GaN, SiC wafers measuring sheet resistance, carrier mobility, and Hall effect for RF and power electronics. Essential for compound semiconductor IC production. HTS 9030.82.00.00 classification.
Wafer-Level Burn-in Test System
Temperature-controlled chamber with probe cards stressing entire wafers at elevated temperatures to screen infant mortality in ICs. Monitors electrical parameters during burn-in. Classified HTS 9030.82.00.00 for semiconductor device checking.
3D NAND Wafer Overlay Metrology Tool
Advanced scatterometry tool measuring overlay accuracy between multiple 3D NAND flash memory layers on wafer. Critical for high-density memory production. HTS 9030.82.00.00 for semiconductor wafer checking instruments.
Advanced Packaging Wafer Test Handler
Automated handler probing known good die (KGD) on wafers for 2.5D/3D IC packaging applications. Tests interposer and through-silicon via (TSV) structures. Under HTS 9030.82.00.00 for semiconductor device checking.