IGBT Silicon Die on Wafer
200mm silicon wafer containing unmounted insulated-gate bipolar transistor (IGBT) chips rated 1200V/200A for industrial motor drives and UPS systems. Classified as unmounted semiconductor dice under HTS 8541.59.00.40. Post-import processing includes wire bonding and encapsulation.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If imported as power supply assemblies
IGBT modules fully assembled with heat sinks become power supply static converters under 8504.
If after dicing and plastic encapsulation
Discrete packaged IGBTs shift to 'thyristors, diacs and triacs' or other discrete devices in 8541.29.
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Import Tips & Compliance
• Specify trench-field-stop technology and safe operating area (SOA) curves; ensure no passivation or backside metallization indicating mounting; comply with RoHS for lead-free processing
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