8-Inch Silicon CMOS Sensor Wafer
300mm silicon wafer with unseparated CMOS image sensor chips for industrial machine vision cameras, featuring 12MP resolution per die. HTS 8541.59.00.40 applies to photosensitive semiconductor wafers not yet diced. Used in automation and surveillance equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If diced and mounted as photovoltaic cells
Photosensitive dice specifically for solar applications move to 8541.40 when separated and prepared for panel assembly.
If imported as parts of finished cameras
Completed image sensor modules for cameras fall under Chapter 90 as optical instrument parts.
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Import Tips & Compliance
• Document quantum efficiency and spectral response to prove photosensitive semiconductor nature; declare wafer yield and defect maps; avoid classifying as camera parts under 8525
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