8-Inch Silicon CMOS Sensor Wafer from China
300mm silicon wafer with unseparated CMOS image sensor chips for industrial machine vision cameras, featuring 12MP resolution per die. HTS 8541.59.00.40 applies to photosensitive semiconductor wafers not yet diced. Used in automation and surveillance equipment.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Document quantum efficiency and spectral response to prove photosensitive semiconductor nature; declare wafer yield and defect maps; avoid classifying as camera parts under 8525