IGBT Silicon Die on Wafer from Japan
200mm silicon wafer containing unmounted insulated-gate bipolar transistor (IGBT) chips rated 1200V/200A for industrial motor drives and UPS systems. Classified as unmounted semiconductor dice under HTS 8541.59.00.40. Post-import processing includes wire bonding and encapsulation.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify trench-field-stop technology and safe operating area (SOA) curves; ensure no passivation or backside metallization indicating mounting; comply with RoHS for lead-free processing