8541.59.00.40/IGBT Silicon Die on Wafer/China

IGBT Silicon Die on Wafer from China

200mm silicon wafer containing unmounted insulated-gate bipolar transistor (IGBT) chips rated 1200V/200A for industrial motor drives and UPS systems. Classified as unmounted semiconductor dice under HTS 8541.59.00.40. Post-import processing includes wire bonding and encapsulation.

Duty Rate — China → United States

50%

Rate breakdown

9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify trench-field-stop technology and safe operating area (SOA) curves; ensure no passivation or backside metallization indicating mounting; comply with RoHS for lead-free processing

IGBT Silicon Die on Wafer from China — Import Duty Rate | HTS 8541.59.00.40