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Electron Beam Mask Writer

A precision machine that uses electron beam lithography to directly write patterns onto photomask blanks for semiconductor reticles. It falls under HTS 8486.40.0010 as it is specifically used for the manufacture of masks and reticles in semiconductor production.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+25.0%25%
🇲🇽MexicoFree—Free
🇨🇦CanadaFree—Free
🇩🇪GermanyFree—Free
🇯🇵JapanFree—Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.20.00Same rate: 25%

If used for direct wafer patterning rather than masks

Direct wafer exposure machines fall under machines for semiconductor device manufacture, not specifically mask/reticle equipment.

9017.20.70Higher: 37.5% vs 25%

If classified primarily as optical inspection equipment

Other microscopes and diffraction apparatus in Chapter 90 may apply if primary function is inspection rather than mask writing.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Verify equipment is solely for mask/reticle production with manufacturer specs to confirm HTS classification

• Include detailed technical documentation proving semiconductor boule/wafer manufacturing use for customs clearance

• Avoid misclassification as general lithography equipment by providing statistical note evidence