Binary Mask Etching Equipment

Reactive ion etching system optimized for pattern transfer in binary photomask production. Essential mask manufacturing apparatus under HTS 8486.40.0010 statistical note.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+25.0%25%
🇲🇽MexicoFreeFree
🇨🇦CanadaFreeFree
🇩🇪GermanyFreeFree
🇯🇵JapanFreeFree

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8486.40.00Same rate: 25%

If for flat panel display mask etching

FPD mask processing equipment tracked separately from IC masks.

8479.89Lower: 12.5% vs 25%

If general semiconductor processing machines

Unspecified semiconductor machines may apply if mask specificity unclear.

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Import Tips & Compliance

Include etch rate uniformity specs (<2% across mask) and chrome etch selectivity

Document vacuum chamber design for mask handling without contamination

Distinguish from wafer etching equipment through substrate handling specifications