Binary Mask Etching Equipment from Germany
Reactive ion etching system optimized for pattern transfer in binary photomask production. Essential mask manufacturing apparatus under HTS 8486.40.0010 statistical note.
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include etch rate uniformity specs (<2% across mask) and chrome etch selectivity
• Document vacuum chamber design for mask handling without contamination
• Distinguish from wafer etching equipment through substrate handling specifications