Outer Ring for Cylindrical Roller Bearings in Wafer Slicing Saws

Precision outer ring component for cylindrical roller bearings in diamond wafer slicing saws that cut monocrystalline semiconductor boules into wafers. Engineered for high-speed, vibration-free operation to maintain slice precision within microns. Falls under 8482.99.65.60 as a part for cylindrical roller bearings in semiconductor wafer preparation equipment.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China5.8%+35.0%40.8%
🇲🇽Mexico5.8%+10.0%15.8%
🇨🇦Canada5.8%+10.0%15.8%
🇩🇪Germany5.8%+10.0%15.8%
🇯🇵Japan5.8%+10.0%15.8%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8482.99.65Same rate: 40.8%

If specifically for semiconductor crystal grinders instead of saws

Different statistical suffixes distinguish parts by specific semiconductor processing step.

8466.94.65Lower: 39.7% vs 40.8%

If for use in general precision grinding machines

Parts of metal-working machine tools classify in heading 8466, not bearing parts.

8482.10.50Higher: 44% vs 40.8%

If imported as complete thrust cylindrical roller bearing assembly

Complete bearing assemblies (not parts) have separate provisions from replacement parts.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include engineering drawings showing integration with wafer slicing saw spindle assemblies

Document bore diameter tolerances specific to semiconductor saw blade shafts (typically <50mm)

Avoid misclassification by providing evidence of exclusion from automotive/general industrial use

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