Outer Ring for Cylindrical Roller Bearings in Wafer Slicing Saws from China
Precision outer ring component for cylindrical roller bearings in diamond wafer slicing saws that cut monocrystalline semiconductor boules into wafers. Engineered for high-speed, vibration-free operation to maintain slice precision within microns. Falls under 8482.99.65.60 as a part for cylindrical roller bearings in semiconductor wafer preparation equipment.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include engineering drawings showing integration with wafer slicing saw spindle assemblies
• Document bore diameter tolerances specific to semiconductor saw blade shafts (typically <50mm)
• Avoid misclassification by providing evidence of exclusion from automotive/general industrial use