Inner Race for Bearings in Semiconductor Wafer Grinders
Hardened steel inner race for cylindrical roller bearings supporting rotating platens in wafer grinders that achieve precise wafer thickness for fabrication. Designed for ultra-flatness maintenance during back-grinding processes on silicon wafers. Classified in 8482.99.65.60 for cylindrical roller bearing parts used in wafer preparation equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If designed for wafer polishers/lappers rather than grinders
Statistical breaks distinguish preparation equipment types per semiconductor notes.
If made primarily of ceramic materials
Ceramic bearing components (for high-purity needs) classify by material composition.
If as unspecified replacement part of complete semiconductor machine
Complete semiconductor processing machines carry their parts in 8479.90.
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Import Tips & Compliance
• Certify surface finish specs (Ra <0.1μm) proving suitability only for semiconductor wafer grinding
• Include end-user statements confirming exclusive use in 300mm wafer fab equipment
• Watch for reclassification if dimensions match general industrial grinder bearings
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