Inner Race for Bearings in Semiconductor Wafer Grinders from China
Hardened steel inner race for cylindrical roller bearings supporting rotating platens in wafer grinders that achieve precise wafer thickness for fabrication. Designed for ultra-flatness maintenance during back-grinding processes on silicon wafers. Classified in 8482.99.65.60 for cylindrical roller bearing parts used in wafer preparation equipment.
Duty Rate — China → United States
40.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Certify surface finish specs (Ra <0.1μm) proving suitability only for semiconductor wafer grinding
• Include end-user statements confirming exclusive use in 300mm wafer fab equipment
• Watch for reclassification if dimensions match general industrial grinder bearings