Inner Race for Bearings in Semiconductor Wafer Grinders from Mexico
Hardened steel inner race for cylindrical roller bearings supporting rotating platens in wafer grinders that achieve precise wafer thickness for fabrication. Designed for ultra-flatness maintenance during back-grinding processes on silicon wafers. Classified in 8482.99.65.60 for cylindrical roller bearing parts used in wafer preparation equipment.
Duty Rate — Mexico → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Certify surface finish specs (Ra <0.1μm) proving suitability only for semiconductor wafer grinding
• Include end-user statements confirming exclusive use in 300mm wafer fab equipment
• Watch for reclassification if dimensions match general industrial grinder bearings