Outer Ring for Cylindrical Roller Bearings in Wafer Slicing Saws from Mexico
Precision outer ring component for cylindrical roller bearings in diamond wafer slicing saws that cut monocrystalline semiconductor boules into wafers. Engineered for high-speed, vibration-free operation to maintain slice precision within microns. Falls under 8482.99.65.60 as a part for cylindrical roller bearings in semiconductor wafer preparation equipment.
Duty Rate — Mexico → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include engineering drawings showing integration with wafer slicing saw spindle assemblies
• Document bore diameter tolerances specific to semiconductor saw blade shafts (typically <50mm)
• Avoid misclassification by providing evidence of exclusion from automotive/general industrial use