Outer Ring for Cylindrical Roller Bearings in Wafer Slicing Saws from Japan
Precision outer ring component for cylindrical roller bearings in diamond wafer slicing saws that cut monocrystalline semiconductor boules into wafers. Engineered for high-speed, vibration-free operation to maintain slice precision within microns. Falls under 8482.99.65.60 as a part for cylindrical roller bearings in semiconductor wafer preparation equipment.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include engineering drawings showing integration with wafer slicing saw spindle assemblies
• Document bore diameter tolerances specific to semiconductor saw blade shafts (typically <50mm)
• Avoid misclassification by providing evidence of exclusion from automotive/general industrial use