Outer Ring for Cylindrical Roller Bearings in Wafer Slicing Saws from Japan
Precision outer ring component for cylindrical roller bearings in diamond wafer slicing saws that cut monocrystalline semiconductor boules into wafers. Engineered for high-speed, vibration-free operation to maintain slice precision within microns. Falls under 8482.99.65.60 as a part for cylindrical roller bearings in semiconductor wafer preparation equipment.
Duty Rate — Japan → United States
30.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include engineering drawings showing integration with wafer slicing saw spindle assemblies
• Document bore diameter tolerances specific to semiconductor saw blade shafts (typically <50mm)
• Avoid misclassification by providing evidence of exclusion from automotive/general industrial use