Other
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Parts: > Other > Other: > Other
Duty Rate (from China)
Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Products classified under HTS 8479.90.95.91
Crystal Boule Grinder
Machine that grinds semiconductor crystal boules to precise diameter and adds flats indicating conductivity type and resistivity. Meets HTS 8479.90.95 as wafer preparation equipment per statistical note. Essential step before wafer slicing in semiconductor production.
8479.90.95Double-Sided Wafer Polisher
Machine simultaneously polishing both sides of semiconductor wafers to mirror finish using chemical-mechanical planarization (CMP). HTS 8479.90.95 for wafer preparation polishers in statistical note. Achieves nanometer-level surface flatness.
8479.90.95Silicon Ingot Grinder
Precision grinder for shaping silicon ingots to exact diameter prior to wafer slicing in semiconductor production. Classified HTS 8479.90.95 as crystal grinder per statistical note. Handles 200mm-450mm diameter ingots.
8479.90.95Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and contamination during handling. HTS 8479.90.95 as specialized wafer preparation apparatus. Applies rounded bevels meeting SEMI standards.
8479.90.95Crystal boule Annealing Furnace
High-temperature furnace for annealing semiconductor boules to relieve stresses post-growth. Classified under HTS 8479.90.95 as semiconductor processing equipment. Provides controlled cooling rates to prevent defects.
8479.90.95Wafer Cleaning Centrifuge
High-speed centrifuge removing contaminants from semiconductor wafers post-polishing via centrifugal force. HTS 8479.90.95 for wafer preparation equipment. Handles 25-50 wafers per cycle.
8479.90.95Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by the Czochralski method for semiconductor wafer manufacturing. It falls under HTS 8479.90.95 as a specialized semiconductor manufacturing machine not specified elsewhere in Chapter 84. This equipment is critical for growing high-purity crystals from which wafers are sliced.
8479.90.95Float Zone Crystal Furnace
Equipment employing the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible. Classified in HTS 8479.90.95 as other semiconductor manufacturing machinery having individual functions. Used primarily for high-resistivity silicon wafers.
8479.90.95Semiconductor Wafer Slicing Saw
Precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules. Classified under HTS 8479.90.95 as specialized wafer preparation equipment. Features coolant systems and tension control for damage-free slicing.
8479.90.95Wafer Lapping Machine
Equipment that lap semiconductor wafers to precise thickness and flatness using abrasive slurries. Falls under HTS 8479.90.95 per statistical note for wafer preparation apparatus. Critical for achieving total thickness variation (TTV) specifications.