Wafer Slicing Diamond Saw Blade
Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general circular saw blades
Standard saw blades not specialized for semiconductor wafers fall under tools of base metals in 8202.
If sold as millstones or grinding wheels
Diamond abrasives without machine-specific design are classified by material in Chapter 68.
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Import Tips & Compliance
• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g
• <100 micron kerf)
• Pair with boule slicing machine invoices to establish part-of-machine status
• Avoid misclassification by specifying 'not for general glass cutting' in docs
Related Products under HTS 8475.90.90.00
Glass Envelope Lamp Assembly Conveyor Belt
Durable conveyor belt component for machines assembling electric lamps in glass envelopes, facilitating automated production lines. Classified as other parts under HTS 8475.90.90.00.
Flashbulb Sealing Machine Vacuum Pump
Specialized vacuum pump for machines sealing flashbulbs in glass envelopes during electronic component assembly. Part of assembly machines under HTS 8475.90.90.00.
Wafer Polisher Slurry Feed Pump
Precision peristaltic pump for delivering polishing slurry in wafer polishers during semiconductor surface preparation. Classified as part of wafer prep equipment in HTS 8475.90.90.00.
Czochralski Crystal Puller Spare Gearbox
This precision gearbox is a replacement part for Czochralski crystal pullers used in semiconductor wafer manufacturing to grow monocrystalline silicon boules. It falls under HTS 8475.90.90.00 as a part of machines for hot working glass or glassware, specifically crystal growers for semiconductor processing.
Float Zone Crystal Grower Heating Element
A high-temperature heating element designed for float zone crystal growers that produce pure monocrystalline semiconductor boules from polysilicon rods. Classified under HTS 8475.90.90.00 as a part of hot working glass machinery for semiconductor material growth.
Crystal Boule Grinder Spindle Assembly
Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. Parts of wafer preparation equipment classified in HTS 8475.90.90.00.