Wafer Slicing Diamond Saw Blade from Japan
Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g
• <100 micron kerf)
• Pair with boule slicing machine invoices to establish part-of-machine status
• Avoid misclassification by specifying 'not for general glass cutting' in docs