8475.90.90.00/Wafer Slicing Diamond Saw Blade/Japan

Wafer Slicing Diamond Saw Blade from Japan

Precision diamond-impregnated saw blade for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It is a part of wafer preparation equipment under HTS 8475.90.90.00 for semiconductor manufacturing machines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit blueprints proving blade specs match semiconductor wafer tolerances (e.g

• <100 micron kerf)

• Pair with boule slicing machine invoices to establish part-of-machine status

• Avoid misclassification by specifying 'not for general glass cutting' in docs